DS90UH940-Q1 Datasheet, PDF (77/87 Pages) Texas Instruments – FPD-Link III to CSI-2 Deserializer

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DS90UH940-Q1
SNLS478A – NOVEMBER 2014 – REVISED JANUARY 2016
11.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown in Figure 42:
Device
DS90UH940-Q1
Pin Count
64
Table 15. No Pullback WQFN Stencil Aperture Summary
Mkt Dwg
NKD
PCB I/O Pad
Size (mm)
0.25 x 0.6
PCB Pitch
(mm)
0.5
PCB DAP
Size(mm)
7.2 x 7.2
Stencil I/O
Stencil DAP
Aperture (mm) Aperture (mm)
0.25 x 0.6
1.16 x 1.16
Number OF
DAP Aperture
Openings
25
Gap between
DAP Aperture
(Dim A mm)
0.2
64X (0.6)
64
64X (0.25)
1
SYMM
(1.36) TYP
49
48
60X (0.5)
(1.36)
TYP
SYMM
(8.8)
METAL
TYP
16
33
17
32
25X (1.16)
(8.8)
Figure 42. 64-Pin WQFN Stencil Example of Via and Opening Placement
(dimensions in mm)
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