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LM98640QML-SP Datasheet, PDF (7/54 Pages) Texas Instruments – Dual Channel, 14-Bit, 40 MSPS Analog Front End with LVDS Output
www.ti.com
LM98640QML-SP
SNAS461D – MAY 2010 – REVISED SEPTEMBER 2015
6.4 Thermal Information(1)
THERMAL METRIC(2)
NBB0068D
PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
11.1, (225 LFPM)
16.5, (0 LFPM)
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
1.2
(1) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature,
TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX – TA)/θJA. The values for maximum power dissipation
listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven
beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.
(2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Quality Conformance Inspection
MIL-STD-883, Method 5005 - Group A
SUBGROUP
1
2
3
4
5
6
7
8A
8B
9
10
11
12
13
14
DESCRIPTION
Static tests at
Static tests at
Static tests at
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
Setting time at
Setting time at
Setting time at
TEMP (°C)
+25
+125
-55
+25
+125
-55
+25
+125
-55
+25
+125
-55
+25
+125
-55
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