LM98640QML-SP Datasheet, PDF (2/54 Pages) Texas Instruments – Dual Channel, 14-Bit, 40 MSPS Analog Front End with LVDS Output

LM98640QML-SP
SNAS461D – MAY 2010 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6
6.2 ESD Ratings
.................................................... 6
6.3 Recommended Operating Conditions⁽²⁾ ................... 6
6.4 Thermal Information
......................... 7
6.5 Quality Conformance Inspection ............................... 7
6.6 LM98640QML Electrical Characteristics................... 8
6.7 AC Timing Specifications ....................................... 16
6.8 Operating Life Test Delta Parameters T_A at
25°C⁽⁵⁾...................................................................... 17
6.9 Typical Performance Characteristics ...................... 18
7 Detailed Description ............................................ 20
7.1 Overview ................................................................. 20
7.2 Functional Block Diagram ....................................... 20
7.3 Feature Description................................................. 21
7.4 Device Functional Mode ......................................... 32
7.5 Programming........................................................... 34
7.6 Register Maps ......................................................... 36
8 Application and Implementation ........................ 46
8.1 Application Information............................................ 46
8.2 Typical Application ................................................. 47
8.3 Initialization Set Up ................................................ 47
9 Layout ................................................................... 48
9.1 Layout Guidelines ................................................... 48
10 Device and Documentation Support ................. 49
10.1 Device Support .................................................... 49
10.2 Community Resources.......................................... 49
10.3 Export Control Notice............................................ 49
10.4 Trademarks ........................................................... 49
10.5 Electrostatic Discharge Caution ............................ 49
10.6 Glossary ................................................................ 49
11 Mechanical, Packaging, and Orderable
Information ........................................................... 50
11.1 Engineering Samples ............................................ 50
4 Revision History
Changes from Revision C (April 2013) to Revision D
Page
• Added, updated, or revised the following sections in accordance with new datasheet standards: Description, Pin
Configuration and Functions, Specifications, Detailed Description, Application and Implementation, Power Supply
Recommendations, Layout, Device and Documentation Support, Mechanical, Packaging, and Ordering Information ........ 1
• Changed CLPIN I_IH from 44 to 100 μA ................................................................................................................................... 8
• Changed SEN I_IH from 28 to 100 μA ..................................................................................................................................... 8
• Changed SEN I_IL from -70 to -100 μA .................................................................................................................................... 8
• Changed INCLK I_IHL from 36 to 100 μA ................................................................................................................................. 8
• Added mininum limits for t_DSO, t_DSE, t_QSR and t_QHF and deleted maximum limits................................................................... 16
• Added details on register write. ........................................................................................................................................... 34
• Changed Device Revision ID from x01 to x48 .................................................................................................................... 37
• Changed Device Revision ID from x01 to x48 .................................................................................................................... 45
• Added TID test and ELDRS-free information ...................................................................................................................... 46
Changes from Revision B (January 2011) to Revision C
Page
• layout of datasheet from National to TI format ....................................................................................................................... 1
Changes from Revision A (May 2010) to Revision B
Page
• Changed Thermal Resistance Unit of measure & Tjc Limit .................................................................................................. 6
2
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