GRJ43DR72J104KWJ1L Datasheet, PDF (212/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

C02E.pdf !Note • Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uint’tsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our
sales repres_•e_Tnt_ha_istiv_ce_as_tao_lor _gpr_ho_ad_suc_ot_ne_lyn_tg_yi_pn_ie_ce_ar_ls_spb_ee_cfo_ifr_ice_ao_tir_od_ne_sri_bn_eg_c. _{ause there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
10.12.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
Continued from the preceding page.
4. Reflow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. In order to prevent mechanical
damage, preheating is required for both the components
and the PCB board. Preheating conditions are shown in
Table 1. It is required to keep the temperature differential
between the soldering and the components surface (∆T)
as small as possible.
Solderability of Tin plating termination chips might be
deteriorated when low temperature soldering profile
where peak solder temperature is below the Tin melting
point is used. Please confirm the solderability of Tin
plating termination chips before use.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
(∆T) between the component and solvent within the
range shown in the Table 1.
Table 1
Part Number
G--18/21/31
G--32/42/43/52/55
Temperature Differential
∆TV190D
∆TV130D
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature 230-250°C 230-240°C
240-260°C
Atmosphere
Air
Air
Air or N2
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
!Caution
[Standard Conditions for Reflow Soldering]
Infrared Reflow
Temperature (D)
Peak Temperature
200°C

,
,
,
∆T
170°C
150°C


,,

,,

,,

 ^130°C
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 30-60 seconds
Vapor Reflow
Temperature (D)
Peak Temperature

,
,
,
 _∆T
170°C

,
,
,
 150°C

,
,
,
 ^130°C
Preheating
Soldering
Gradual
Cooling
Time
60-120 seconds 20 seconds max.
[Allowable Soldering Temperature and Time]
270
,
,
, ₂₆₀
250
,
,
, ₂₄₀
,
,
, ²³⁰
0
30
60
90
Soldering Time (sec.)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Optimum Solder Amount for Reflow Soldering
Overly thick application of solder paste results in
excessive solder fillet height.
This makes the chip more susceptible to mechanical and
thermal stress on the board and may cause cracked
chips.
Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in chips
breaking loose from the PCB.
Make sure the solder has been applied smoothly to the
end surface to a height of 0.2mm min.
[Optimum Solder Amount for Reflow Soldering]
0.2mm min.
in section
Inverting the PCB
Make sure not to impose an abnormal mechanical shock on
the PCB.
Continued on the following page.
211