GRJ43DR72J104KWJ1L Datasheet, PDF (182/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

C02E.pdf !Note • Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uint’tsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our
sales repres_•e_Tnt_ha_istiv_ce_as_tao_lor _gpr_ho_ad_suc_ot_ne_lyn_tg_yi_pn_ie_ce_ar_ls_spb_ee_cfo_ifr_ice_ao_tir_od_ne_sri_bn_eg_c. _{ause there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
10.12.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
Only for Information Devices SpecificGaRti4onSseraiensd STpeesct iMficeathtioodnss and Test Methods
Continued from the preceding page.
No.
Item
No marking defects
Specifications
b
φ4.5
d
U,Q_c
TX
RSUVWZ,Q_`XY^ ^{12 Deflection}
a
100
t : 1.6
Fig. 2
LZW
Dimension (mm)
(mm)
a
b
c
d
4.5Z2.0
3.5
7.0
2.4
4.5Z3.2
3.5
7.0
3.7
1.0
Test Method
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
(in mm)
5.7Z5.0
4.5
8.0
5.6
Fig. 3
13
Solderability of
Termination
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects
Capacitance
Change
Within T10%
D.F.
14
Resistance
to Soldering
I.R.
Heat
0.025 max.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
Perform a heat treatment at 150^W Y10 0D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
*Preheating
Step
1
2
Temperature
100 to 120D
170 to 200D
Time
1 min.
1 min.
Appearance No marking defects
Capacitance
Change
Within T15%
D.F.
0.05 max.
I.R.
More than 3,000MΩ
15
Temperature
Cycle
Dielectric
Strength
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
Step
1
2
3
4
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Max. Operating Temp.T2
Room Temp.
Time (min.)
30T3
2 to 3
30T3
2 to 3
#Pretreatment
Perform a heat treatment at 150^W Y100D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
Glass Epoxy Board
Solder resist
Cu
Fig. 4
Appearance No marking defects
Capacitance
Humidity ^Change
16 (Steady D.F.
State) _I.R.
Within T15%
0.05 max.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500^W Y²⁴ 0 hrs.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
#Pretreatment
Perform a heat treatment at 150^W Y100D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
181