GRJ43DR72J104KWJ1L Datasheet, PDF (100/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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0. specifications before ordering.
GJM Series Specifications and Test Methods (1)
Continued from the preceding page.
No.
Item
Specifications
Temperature Compensating Type
Test Method
Appearance No defects or abnormalities
Solder the capacitor to the test jig (glass epoxy board) in the
Capacitance Within the specified tolerance
same manner and under the same conditions as (10).
The capacitor should be subjected to a simple harmonic motion
11
Vibration
Resistance
Q
30pF and over: QU1000
30pF and below: QU400W20C
C: Nominal Capacitance (pF)
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz.
The frequency range, from 10 to 55Hz and return to 10Hz,
should be traversed in approximately 1 minute. This motion
should be applied for a period of 2 hours in each of 3 mutually
perpendicular directions (total of 6 hours).
TWX_`VZUYZ^V,
QRSWT^YZ ^{Appearance Nomarkingdefects}
Capacitance Within T5% or T0.5pF
Change
(whichever is larger)
b
12 Deflection
Type
GJM03
GJM15
c
a
100
a
0.3
0.4
φ4.5
t: 0.8mm
b
c
0.9
0.3
1.5
0.5
Solder the capacitor to the test jig (glass epoxy boards) shown
in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
R230
20 ₅₀ Pressurizing
speed: 1.0mm/sec.
Pressurize
Capacitance meter
Flexure : V1
Fig. 2
(in mm)
45
45
(in mm)
Fig. 3
13
Solderability of
Termination
75% of the terminations are to be soldered evenly and
continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Preheat at 80 to 120D for 10 to 30 seconds. After preheating,
immerse in eutectic solder solution for 2T0.5 seconds at 230T5D
or Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5°C.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Resistance
14 to Soldering
Heat
Capacitance
Change
Q
Within T2.5% or T0.25pF
(whichever is larger)
30pF and over: QU1000
30pF and below: QU400W20C
C: Nominal Capacitance (pF)
Preheat the capacitor at 120 to 150D for 1 minute.
Immerse the capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu
solder solution at 270T5D for 10T0.5 seconds.
Let sit at room temperature for 24T2 hours.
I.R.
More than 10,000MΩ or 500Ω · F (whichever is smaller)
Dielectric
Strength
No failure
15
Temperature
Cycle
Appearance
Capacitance
Change
Q
I.R.
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within T2.5% or T0.25pF
(whichever is larger)
30pF and over: QU1000
30pF and below: QU400W20C
C: Nominal Capacitance (pF)
More than 10,000MΩ or 500Ω · F (whichever is smaller)
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10). Perform the five cycles
according to the four heat treatments listed in the following table.
Let sit for 24T2 hours at room temperature, then measure.
Step
1
2
3
4
Temp. (D)
Min. Operating
Temp.W0/Y3
Room
Temp.
Max. Operating
Temp.W3/Y0
Room
Temp.
Time (min.) 30T3
2 to 3
30T3
2 to 3
Dielectric
Strength
No failure
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Humidity,
16 Steady
State
Capacitance
Change
Q
Within T5% or T0.5pF
(whichever is larger)
30pF and below:
QU350
10pF
and
over,
30pF
and
below:
QU275W
5
2
C
10pF and below:
QU200W10C
C: Nominal Capacitance (pF)
Let the capacitor sit at 40T2D and 90 to 95% humidity for
500T12 hours.
Remove and let sit for 24T2 hours (temperature compensating
type) at room temperature, then measure.
I.R.
More than 10,000MΩ or 500Ω · F (whichever is smaller)
Continued on the following page.
98