GRJ43DR72J104KWJ1L Datasheet, PDF (149/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Notice
Continued from the preceding page.
GNMpp2
Chip Capacitor
a
c
p
b
Land
GNMpp4
LLA
Notice
Chip Capacitor
a
b
c
p
Land
Table 3 GNM, LLA Series for Reflow Soldering Land Dimensions
Part Number
GNM0M2
GNM1M2
Dimensions (mm)
L
W
a
b
0.9
0.6
0.12 to 0.20*
0.35 to 0.40*
1.37
1.0
0.4 to 0.5
0.35 to 0.45
GNM212
GNM214
GNM314
LLA18
2.0
1.25
0.6 to 0.7
0.5 to 0.7
2.0
1.25
0.6 to 0.7
0.5 to 0.7
3.2
1.6
0.8 to 1.0
0.7 to 0.9
1.6
0.8
0.3 to 0.4
0.25 to 0.35
LLA21
LLA31
2.0
1.25
0.5 to 0.7
0.35 to 0.6
3.2
1.6
0.7 to 0.9
0.4 to 0.7
* 0.82Va+2bV1.00
c
0.3
0.3 to 0.35
0.4 to 0.5
0.25 to 0.35
0.3 to 0.4
0.15 to 0.25
0.2 to 0.3
0.3 to 0.4
LLM
ea
p
c
Chip Capacitor
b
c'
b'
f
d
Table 4 LLM Series for Reflow Soldering Land Dimensions
Part Number
LLM21
LLM31
a
0.6 to 0.8
1.0
b, b'
(0.3 to 0.5)
(0.3 to 0.5)
b=(c-e)/2, b'=(d-f)/2
c, c'
0.3
0.4
Dimensions (mm)
d
e
2.0 to 2.6
1.3 to 1.8
3.2 to 3.6
1.6 to 2.0
f
1.4 to 1.6
2.6
p
0.45
0.64
1.0
0.5
0.8
0.4
0.5
0.8
p
0.5
0.8
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
2. Low viscosity adhesive can cause chips to slip after
mounting. The adhesive must have a viscosity of
5000Pa • s (500ps) min. (at 25°C).
3. Adhesive Coverage
Part Number
Adhesive Coverage*
GRM18, GQM18
0.05mg min.
GRM21, LLL21, GQM21
0.1mg min.
GRM31, LLL31
0.15mg min.
*Nominal Value
Board
Chip Capacitor
Adhesive
Land
a=20 to 70µm
b=30 to 35µm
c=50 to 105µm
a
c
b
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