GRJ43DR72J104KWJ1L Datasheet, PDF (154/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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10.12.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
Reference Data
Continued from the preceding page.

RSTWXSTXWXZ^_`,
QRSUVY_`,
QRSUVWXYZ^Y^Y^ ^(4)Results
GRM21 5C (T=0.6)
100
80
60
40 ^{Larger Fillet}
Fillet up to Chip
Thickness
20
0
0
2
4
6
8
Flexure (mm)
GRM21 F5 (T=0.6)
100
80
Fillet up to Chip
60
Thickness
40 _{Larger Fillet}
20
0
0
2
4
6
8
Flexure (mm)
GRM21 R7 (T=0.6)
,Q ¹⁰⁰
80
Fillet up to Chip
60
Thickness
40
,
QRSTUVWXZLarger Fillet
20
0
0
2
4
6
8
T_`UVYZ^_`^Flexure(mm)
3. Temperature Cycling for Solder Fillet Height
(1) Test Method
Solder the chips to the substrate of various test fixtures
using sufficient amounts of solder to achieve the required
fillet height. Then subject the fixtures to the cycle
illustrated at right 200 times.
[Temperature Cycling]
+125D
Room Temperature
-55D
Time (min.)
5 30 5 30
q Solder Amount
Alumina substrates are typically designed for reflow
soldering.
Glass epoxy or paper phenol substrates are typically
used for flow soldering.
w Material
Alumina
(Thickness: 0.64mm)
Glass epoxy (Thickness: 1.64mm)
Paper phenol (Thickness: 1.64mm)
[Solder Amount]
Substrate
Alumina
q
Glass Epoxy
or Paper Phenol
w
e
Solder to be used
6Z4 Eutectic solder
e Land Dimension
152
[Land Dimension]
1.5 1.2 1.5
(in mm)
Land Pattern
Alumina
Substrate
Ag/Pd=72/28
Thickness: 10 to 12µm
Glass Epoxy
Substrate
Paper Phenol
Substrate
Cu
Thickness: 35µm
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