GRJ43DR72J104KWJ1L Datasheet, PDF (151/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Notice
Continued from the preceding page.
7. Coating
1. A crack may be caused in the capacitor due to the stress
of the thermal contraction of the resin during curing
process.
The stress is affected by the amount of resin and curing
contraction.
Select a resin with small curing contraction.
The difference in the thermal expansion coefficient
between a coating resin or a molding resin and the
capacitor may cause the destruction and deterioration of
the capacitor such as a crack or peeling, and lead to the
deterioration of insulation resistance or dielectric
breakdown.
Notice
Select a resin for which the thermal expansion coefficient
is as close to that of capacitor as possible.
A silicone resin can be used as an under-coating to buffer
against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions
may cause the deterioration of the insulation resistance of
a capacitor.
An epoxy resin can be used as a less hygroscopic resin.
8. Die Bonding/Wire Bonding (GMA or GMD Series)
1. Die Bonding of Capacitors
• Use the following materials for the Brazing alloys:
Au-Sn (80/20) 300 to 320 °C in N2 atmosphere
• Mounting
(1) Control the temperature of the substrate so it
matches the temperature of the brazing alloy.
(2) Place the brazing alloy on the substrate and place
the capacitor on the alloy. Hold the capacitor and
gently apply the load. Be sure to complete the
operation within 1 minute.
2. Wire Bonding
• Wire
Gold wire: 25 micro m (0.001 inch) diameter
• Bonding
(1) Thermo compression, ultrasonic ball bonding.
(2) Required stage temperature: 150 to 200 °C
(3) Required wedge or capillary weight: 0.2N to 0.5N
(4) Bond the capacitor and base substrate or other
devices with gold wire.
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