GRJ43DR72J104KWJ1L Datasheet, PDF (166/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Medium Voltage Low Dissipation FaGctRoMr SSpeercieifsicSaptieocnisficaantdioTnessat nMdeTtheosdt sMethods
Continued from the preceding page.
No.
Item
No marking defects
Specifications
b
φ4.5
d
U,Q_c
TX
RSVW,Q_`XUYZ^ ^{11 Deflection}
a
100
t : 1.6
Fig. 2
LZW
Dimension (mm)
(mm)
a
b
c
d
2.0Z1.25
1.2
4.0
1.65
3.2Z1.6
2.2
3.2Z2.5
2.2
5.0
5.0
2.0
2.9
1.0
Test Method
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
(in mm)
4.5Z2.0
3.5
7.0
2.4
Fig. 3
12
Solderability of
Termination
75% of the terminations are to be soldered evenly
and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Immerse in
solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects
Capacitance
Change
13
Resistance
to Soldering
Q
Heat
I.R.
Within T2.5%
1,000 min.
More than 10,000MΩ
Dielectric
Strength
In accordance with item No.4
Preheat the capacitor at 120 to 150D* for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1 sec.
Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
*Preheating for more than 3.2Z2.5mm
Step
1
2
Temperature
100 to 120D
170 to 200D
Time
1 min.
1 min.
Appearance No marking defects
Capacitance
Change
Within T2.5%
Q
500 min.
I.R.
More than 10,000MΩ
14
Temperature
Cycle
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
Step
1
2
3
4
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Max. Operating Temp.T2
Room Temp.
Time (min.)
30T3
2 to 3
30T3
2 to 3
Dielectric
Strength
In accordance with item No.4
Glass Epoxy Board
Fig. 4
Solder resist
Cu
Appearance No marking defects
Humidity
15 (Steady
State)
Capacitance
Change
Q
I.R.
Within T5.0%
350 min.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Appearance No marking defects
Capacitance
Change
Within T3.0%
16 Life
Q
350 min.
I.R.
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500^W Y²⁴⁰ hrs.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
Apply voltage as in Table for 1,000^W Y⁴⁸ 0hrs. at maximum
operating temperature T3D.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
Rated Voltage
DC250V
DC630V, DC1kV,
DC2kV, DC3.15kV
Applied Voltage
150% of the rated voltage
120% of the rated voltage
The charge/discharge current is less than 50mA.
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
165