GRJ43DR72J104KWJ1L Datasheet, PDF (156/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Reference Data
Continued from the preceding page.
4. Board Bending Strength for Board Material
(1) Test Method
Solder the chip to the test board. Then bend the board
using the method illustrated below, to measure
capacitance.
45
Capacitor
Supporting
45
Base
,
QRU U ^1.2
4.0
1.6
,
QRSTVWX XY^,
QRSTUVWZ_₁₀₀
: Copper Foil (0.035mm thick)
: Solder Resist
X`UY^_ ^_ <sub>(2)TestSamples</sub>
X<sup>GRM21 5C/R7/F5 Characteristics T=0.6mm typical</sup>
R230
20 <sup>50</sup> Pressurizing
Speed: 1.0mm/sec.
Pressurize
Note : Material of the pressurizing jig and
the supporting base must be hardened steel
(Hardness : HB183 to 255 or carbide Hardness
Flexure
: HRA90 min.)
Capacitance Meter
Solder Amount
Up to Chip
Thickness
(in mm)
(3) Acceptance Criteria
Products should be determined to be defective if the
change in capacitance has exceeded the values specified
in Table 4.
Table 4
Characteristics
Change in Capacitance
5C
Within T5% or T0.5pF, whichever is greater
R7
F5
STTTWXZ_`,
QRU,
QRUVWYZ,
QRSUVWXYZ^_^TTWXZ_`,
QRSUV,
QRSTUVWXYZ^_`Z^_UY ^(4)Results
Within T12.5%
Within T20%
GRM21 5C (T=0.6)
100
80
60
40
20
0
0
Glass Epoxy
Paper Phenol
2
4
6
8
Flexure (mm)
GRM21 F5 (T=0.6)
100
80
60
40
20
0
0
Paper Phenol
Glass Epoxy
2
4
6
8
Flexure (mm)
,
QRSTUVWXYZ^_`^_` ₁₅₄
GRM21 R7 (T=0.6)
100
Paper Phenol
80
60
40
Glass Epoxy
20
0
0
2
4
6
8
Flexure (mm)
Continued on the following page.