GRJ43DR72J104KWJ1L Datasheet, PDF (157/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

C02E.pdf !Note • Th!is PNDoFteca•taPlolegasisedroewadnlroaatdinegdafnrodm!thCeAwUeTbIOsiNte(ofof rMsutoraratageM, aonpuefraactitnugri,nrgatcinog.,,ltsdo.ldTehreinregf,omreo,uint’tsinsgpaencdifichaatniodnlisnga)reinstuhbisjeccatttaolocghatongpereovreonut rsmprookdiuncgtsanind/iot rmbauyrnbiengd,isectco.ntinued without advance notice. Please check with our
sales repres_•e_Tnt_ha_istiv_ce_as_tao_lor _gpr_ho_ad_suc_ot_ne_lyn_tg_yi_pn_ie_ce_ar_ls_spb_ee_cfo_ifr_ice_ao_tir_od_ne_sri_bn_eg_c. _{ause there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
10.12.20 ^{• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.}
Continued from the preceding page.
5. Break Strength
(1) Test Method
Place the chip on a steel plate as illustrated on the right.
Increase load applied to a point near the center of the
test sample.
(2) Test Samples
GRM21 5C/R7/F5 Characteristics
GRM31 5C/R7/F5 Characteristics
(3) Acceptance Criteria
Define the load that has caused the chip to break or
crack, as the bending force.
(4) Explanation
Break strength, P, is proportionate to the square of the
thickness of the ceramic element and is expressed as a
curve of secondary degree.
The formula is:
2^γ WT²
P=
(N)
3L
W : Width of ceramic element (mm)
T : Thickness of element
(mm)
L : Distance between fulcrums (mm)
γ : Bending stress
(N/mm²)
Reference Data
Storage
scope
Amplifier
P
Pressurizing
speed: 2.5mm/sec.
Load cell
Loading Jig End
φ1.0mm
Sample
Steel plate
P0.5mm
STWX,
QRUYZ^__W
γ
Chip Size L W 5C
R7
F5
T
Charac- Charac- Charac-
` ^{teristics teristics teristics}
L
GRM21 1.5 1.2
300 180 160
GRM31 2.7 1.5
(in mm)
(5) Results
GRM21
140
120
5C
R7 _F5
100
80
60
40
20
0
0
0.4
0.8
1.2
1.6
Thickness of Ceramic Element (mm)
6. Thermal Shock
(1) Test method
After applying flux (an ethanol solution of 25% rosin), dip
the chip in a solder bath (6Z4 eutectic solder) in
accordance with the following
conditions:
(2) Test samples
GRM21 5C/R7/F5 Characteristics T=0.6mm typical
(3) Acceptance criteria
Visually inspect the test sample with a 60-power optical
microscope. Chips exhibiting breaks or cracks should be
determined to be defective.
GRM31
140
5C
120
100
80
R7 _F5
60
40
20
0
0
0.4
0.8
1.2
1.6
Thickness of Ceramic Element (mm)
Dipping Speed: 25mm/sec.
,
QRU_{Chip Capacitor}
Solder Bath
^`UY25D
Solder
Temperature
∆T
Natural
Cooling
2 sec.
Time
Continued on the following page.
155