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GRJ43DR72J104KWJ1L Datasheet, PDF (198/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors
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10.12.20 • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Safety Standard Certified Type GC/GDG/GAF3/SGeBriSepseScpifeiccaiftiicoantsioannsdaTnedstTMesetthMoedthsods
Continued from the preceding page.
No.
Item
Specifications
Test Method
Appearance No defects or abnormalities
Capacitance Within the specified tolerance
12
Vibration
Resistance
D.F.
Q
13 Deflection
Char.
Specification
X7R
D.F.V0.025
SL
QU400W20C*2 (CF30pF)
QU1000
(CU30pF)
No marking defects
b
φ4.5
d
c
S,QRUa
100
Fig. 2
t : 1.6
T ^_YZ`SVWXURTLZW
Dimension (mm)
(mm)
a
b
c
d
4.5Z2.0
3.5
7.0
2.4
4.5Z3.2
3.5
_`5.7Z2.8
4.5
7.0
8.0
3.7
3.2
1.0
5.7Z5.0
4.5
8.0
5.6
Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each of 3 mutually perpendicular
directions (total of 6 hrs.).
Glass Epoxy Board
Solder resist
Cu
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
R230
20 50 Pressurizing
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
(in mm)
Fig. 3
14
Solderability of
Termination
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects
Capacitance
Change
Resistance
15 to Soldering
Heat
I.R.
Char.
X7R
SL
Capacitance Change
Within T10%
Within T2.5% or T0.25pF
(Whichever is larger)
More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Preheat the capacitor as in table. Immerse the capacitor in
solder solution at 260T5D for 10T1 sec. Let sit at room
condition*1 for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment for X7R char.
Perform a heat treatment at 150Y W10 0D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*1
*Preheating
Step
1
2
Temperature
100 to 120D
170 to 200D
Time
1 min.
1 min.
*1 "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
*2 "C" expresses nominal capacitance value (pF).
Continued on the following page.
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