GRJ43DR72J104KWJ1L Datasheet, PDF (190/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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AC250V(r.m.s.) Type (Which Meet JapGanAe2sSeeLraiews) SSppeecciiffiications and Test Metthhooddss
Continued from the preceding page.
,QU ^No.
Item
No marking defects
Specifications
b
φ4.5
d
c
12 Deflection
a
100
Fig. 2
t : 1.6
TX
RSUVWZ,Q Y^ _LZW
Dimension (mm)
(mm)
a
b
c
d
4.5Z2.0
3.5
7.0
2.4
_`X ^4.5Z3.2
3.5
7.0
3.7
1.0
Test Method
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
(in mm)
5.7Z5.0
4.5
8.0
5.6
Fig. 3
13
Solderability of
Termination
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects
14
Humidity
Insulation
Capacitance
Change
D.F.
I.R.
Within T15%
0.05 max.
More than 1,000MΩ
The capacitor should be subjected to 40T2D, relative humidity of
90 to 98% for 8 hrs., and then removed in room condition* for 16
hrs. until 5 cycles.
Dielectric
Strength
In accordance with item No.4
Appearance No marking defects
Capacitance
Change
Within T10%
Resistance ^D.F.
15 to Soldering I.R.
Heat
0.025 max.
More than 2,000MΩ
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
Perform a heat treatment at 150^W Y10 0D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
*Preheating
Dielectric
Strength
In accordance with item No.4
Step
1
2
Temperature
100 to 120D
170 to 200D
Time
1 min.
1 min.
Appearance No marking defects
Capacitance
Change
Within T15%
D.F.
0.05 max.
I.R.
More than 2,000MΩ
16
Temperature
Cycle
Dielectric
Strength
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
Step
1
2
3
4
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Max. Operating Temp.T2
Room Temp.
Time (min.)
30T3
2 to 3
30T3
2 to 3
#Pretreatment
Perform a heat treatment at 150^W Y10 0D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
Glass Epoxy Board
Fig. 4
Solder resist
Cu
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
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