GRJ43DR72J104KWJ1L Datasheet, PDF (159/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Continued from the preceding page.
8. Thermal Shock when Making Corrections with a
Soldering Iron
(1) Test Method
Apply a soldering iron meeting the conditions below to
the soldered joint of a chip that has been soldered to a
paper phenol board, while supplying wire solder. (Note:
the soldering iron tip should not directly touch the ceramic
element of the chip.)
Reference Data
Mounting Solder
Wire Solder
Paper Phenol Substrate
Soldering lron
Duration of
Touching :
Approx. 3 sec.
(2) Test Samples
GRM21 5C/R7/F5 Characteristics T=0.6mm
(3) Acceptance Criteria for Defects
Observe the appearance of the test sample with a
60-power optical microscope. Those units displaying any
breaks or cracks are determined to be defective.
Soldering Iron
Ceramic heater 20W
Tip Diameter
ø3mm
(4) Results
GRM21 5C (T=0.6)
100
80
60
40
20
0
200
240
280
320
360
Soldering Iron Tip Temperature (D)
GRM21 F5 (T=0.6)
100
80
60
40
20
0
200
240
280
320
360
Soldering Iron Tip Temperature (D)
GRM21 R7 (T=0.6)
100
80
60
40
20
0
200
240
280
320
360
Soldering Iron Tip Temperature (D)
157