GRJ43DR72J104KWJ1L Datasheet, PDF (175/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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GMRedJiuSmerVieosltSagpeecSiofifctaTteiormnsinaantidonTeTsytpeMGetRhJodSseries Specifications and Test Methods
Continued from the preceding page.
TSTX,
QRUVWZZ^_WX`STYZ ^No.
Item
Specifications
Appearance No marking defects
Capacitance
Change
Within ±12.5%
b
φ4.5
d
c
11 Deflection
LZW
(mm)
a
100
t : 1.6
Fig. 2
Dimension (mm)
a
b
c
d
Test Method
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
Flexure=3
Capacitance meter
45
45
2.0Z1.25
1.2
4.0
1.65
(in mm)
3.2Z1.6
2.2
5.0
2.0
Fig. 3
3.2Z2.5
2.2
5.0
2.9
1.0
4.5Z3.2
3.5
7.0
3.7
5.7Z5.0
4.5
8.0
5.6
12
Solderability of
Termination
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
Appearance No marking defects
Capacitance
Change
Within ±10%
D.F.
Resistance
13 to Soldering _I.R.
Heat
0.025 max.
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
Preheat the capacitor at 120 to 150°C^* for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
•Immersing speed: 25±2.5mm/s
•Pretreatment
Perform a heat treatment at 150⁺ –10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Dielectric
Strength
In accordance with item No.4
*Preheating for more than 3.2Z2.5mm
Step
1
2
Temperature
100 to 120°C
170 to 200°C
Time
1 min.
1 min.
Appearance No marking defects
Capacitance
Change
Within ±7.5%
D.F.
0.025 max.
I.R.
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
14
Temperature
Cycle
Dielectric
Strength
In accordance with item No.4
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
Step
1
2
3
4
Temperature (°C)
Min. Operating Temp.±3
Room Temp.
Max. Operating Temp.±2
Room Temp.
Time (min.)
30±3
2 to 3
30±3
2 to 3
•Pretreatment
Perform a heat treatment at 150⁺ –10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
Glass Epoxy Board
Fig. 4
Solder resist
Cu
Appearance No marking defects
Humidity
15 (Steady
State)
Capacitance
Change
Within ±15%
D.F.
0.05 max.
I.R.
CU0.01µF: More than 10MΩ • µF
CF0.01µF: More than 1,000MΩ
Dielectric
Strength
In accordance with item No.4
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500^+–240hrs.
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
•Pretreatment
Perform a heat treatment at 150⁺ –10 0°C for 60±5 min. and then
let sit for 24±2 hrs. at room condition.*
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
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