GRJ43DR72J104KWJ1L Datasheet, PDF (186/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Only for Camera Flash Circuit SpecifGicRat7ioSnesriaensdSTpesctifMiceathioondssand Test Methods
Continued from the preceding page.
,QU ^No.
Item
No marking defects
Specifications
b
φ4.5
d
c
11 Deflection
a
100
Fig. 2
t : 1.6
WX
RSUVZT,Q Y^ _LZW
Dimension (mm)
(mm)
a
b
c
d
2.0Z1.25
1.2
_`X ^3.2Z1.6
2.2
4.0
5.0
1.65
2.0
1.0
Test Method
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
R230
20 ^{50 Pressurizing}
speed: 1.0mm/s
Pressurize
Flexure=1
Capacitance meter
45
45
Fig. 3
(in mm)
12
Solderability of
Termination
75% of the terminations are to be soldered evenly and continuously.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235T5°C H60A or H63A Eutectic Solder
Appearance No marking defects
Capacitance
Change
13
Resistance
to Soldering
D.F.
Heat
I.R.
Dielectric
Strength
Within T10%
0.025 max.
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
In accordance with item No.4
Preheat the capacitor at 120 to 150D for 1 min.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
Perform a heat treatment at 150^W Y10 0 D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
Appearance No marking defects
Capacitance
Change
Within T7.5%
D.F.
0.025 max.
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
I.R.
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
14
Temperature
Cycle
Dielectric
Strength
In accordance with item No.4
Step
1
2
3
4
Temperature (D)
Min. Operating Temp.T3
Room Temp.
Max. Operating Temp.T2
Room Temp.
Time (min.)
30T3
2 to 3
30T3
2 to 3
#Pretreatment
Perform a heat treatment at 150^W Y10 0 D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
Glass Epoxy Board
Solder resist
Cu
Fig. 4
Appearance No marking defects
Humidity
15 (Steady
State)
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Within T15%
0.05 max.
CU0.01µF: More than 10MΩ • µF
CF0.01µF: More than 1,000MΩ
In accordance with item No.4
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500Y ^{W20 4} hrs.
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
#Pretreatment
Perform a heat treatment at 150^W Y10 0 D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
185