GRJ43DR72J104KWJ1L Datasheet, PDF (111/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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0. specifications before ordering.
GQM Series Specifications and TestGMQeMthSoedrsies Specifications and Test Methods
Continued from the preceding page.
TWX_`VZUYZ^V,
QRSWT^YZ ^No.
Item
Specifications
Appearance No defects or abnormalities.
Capacitance Within T5% or T0.5pF
Change
(whichever is larger)
b
φ4.5
12 Deflection
c
a
100
t: 1.6mm
Type
a
b
c
Test Method
Solder the capacitor on the test jig (glass epoxy board) shown
in Fig. 2 using a eutectic solder.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done by the reflow method and should
be conducted with care so that the soldering is uniform and free
of defects such as heat shock.
R230
20 ₅₀ Pressurizing
speed: 1.0mm/sec.
Pressurize
Flexure : V1
GQM18
1.0
3.0
1.2
GQM21
1.2
4.0
1.65
Capacitance meter
45
45
GQM22
2.2
5.0
2.9
Fig. 2
(in mm)
Fig. 3
13
Solderability of
Termination
75% of the terminations are to be soldered evenly
and continuously.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No defects or abnormalities.
Resistance
14 to Soldering
Heat
Capacitance
Change
Q
Within T2.5% or T0.25 pF
(whichever is larger)
30pF and over: QU1400
30pF and below: QU800W20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ
Dielectric
Strength
No defects.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No defects or abnormalities.
15
Temperature
Cycle
Capacitance
Change
Q
Within T2.5% or T0.25pF
(whichever is larger)
30pF and over: QU1400
30pF and below: QU800W20C
C: Nominal Capacitance (pF)
I.R.
More than 10,000MΩ
Dielectric
Strength
No defects.
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No defects or abnormalities.
Humidity
16 Steady
State
Capacitance
Change
Q
Within T5% or T0.5pF
(whichever is larger)
30pF and over: QU350
10pF and over, 30pF and below: QU275+5C/2
10pF and below: QU200W10C
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
80 to 120D for 10 to 30 seconds. After preheating, immerse in
eutectic solder solution for 2T0.5 seconds at 230T5D or
Sn-3.0Ag-0.5Cu solder solution for 2T0.5 seconds at 245T5°C.
Preheat the capacitor at 120 to 150D for 1 minute. Immerse the
capacitor in a eutectic solder or Sn-3.0Ag-0.5Cu solder solution
at 270T5D for 10T0.5 seconds. Let sit at room temperature for
24T2 hours, then measure.
Fix the capacitor to the supporting jig in the same manner and
under the same conditions as (10).
Perform the five cycles according to the four heat treatments
listed in the following table.
Let sit for 24T2 hours at room temperature, then measure.
Step
1
2
3
4
Temp. (D)
Min. Operating
Temp. W0/Y3
Room
Temp.
Max. Operating
Temp. W3/Y0
Room
Temp.
Time (min.) 30T3
2 to 3
30T3
2 to 3
Set the capacitor at 40T2D and in 90 to 95% humidity for
500T12 hours.
Remove and set for 24T2 hours at room temperature, then
measure.
C: Nominal Capacitance (pF)
I.R.
More than 1,000MΩ
Continued on the following page.
109