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GRJ43DR72J104KWJ1L Datasheet, PDF (185/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors
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10.12.20 • This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
GORnl7y SfoerriCesamSpereaciFfilcaasthioCnisrcaunitdSTpeesctiMficeathtiodns and Test Methods
No.
Item
Specifications
1
Operating
Temperature Range
2 Appearance
3 Dimensions
Y55 to W125D
No defects or abnormalities
Within the specified dimensions
4 Dielectric Strength No defects or abnormalities
5
Insulation Resistance
(I.R.)
CU0.01µF: More than 100MΩ • µF
CF0.01µF: More than 10,000MΩ
6 Capacitance
Within the specified tolerance
7
Dissipation
Factor (D.F.)
0.025 max.
Capacitance
8 Temperature
Characteristics
Cap. Change
Within T10% (Apply DC350V bias)
Within
% W22
Y33
(No
DC
bias)
(Temp. Range : Y55 to W125D)
9
Adhesive Strength
of Termination
No removal of the terminations or other defect should occur.
Appearance No defects or abnormalities
Capacitance Within the specified tolerance
10
Vibration
Resistance
D.F.
0.025 max.
Test Method
Y
Visual inspection
Using calipers and micrometers
No failure should be observed when DC500V is applied between
the terminations for 1 to 5 sec., provided the charge/discharge
current is less than 50mA.
The insulation resistance should be measured with DC250T50V
and within 60T5 sec. of charging.
The capacitance/D.F. should be measured at a frequency of
1T0.2kHz and a voltage of AC1T0.2V(r.m.s.)
The capacitance measurement should be made at each step
specified in the Table.
Step
1
2
3
4
5
Temperature (D)
25T2
Min. Operating Temp.T3
25T2
Max. Operating Temp.T2
25T2
#Pretreatment
Perform a heat treatment at 150Y W100D for 60T5 min. and then
let sit for 24T2 hrs. at room condition.*
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 1.
Then apply 10N force in the direction of the arrow.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
10N, 10T1s
Glass Epoxy Board
Fig. 1
Solder the capacitor to the test jig (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 55Hz. The
frequency range, from 10 to 55Hz and return to 10Hz, should be
traversed in approximately 1 min. This motion should be applied
for a period of 2 hrs. in each of 3 mutually perpendicular
directions (total of 6 hrs.).
Glass Epoxy Board
Solder resist
Cu
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued on the following page.
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