GRJ43DR72J104KWJ1L Datasheet, PDF (150/221 Pages) Murata Manufacturing Co., Ltd. – Chip Monolithic Ceramic Capacitors

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Notice
Continued from the preceding page.
3. Adhesive Curing
1. Insufficient curing of the adhesive can cause chips to
disconnect during flow soldering and deterioration in the
insulation resistance between the outer electrodes due to
moisture absorption.
Control curing temperature and time in order to prevent
insufficient hardening.
4. Flux Application
1. An excessive amount of flux generates a large quantity of
flux gas, which can cause a deterioration of Solderability.
Therefore apply flux thinly and evenly throughout. (A
foaming system is generally used for flow soldering.)
2. Flux containing too high a percentage of halide may
cause corrosion of the outer electrodes unless there is
sufficient cleaning. Use flux with a halide content of 0.2%
max.
3. Do not use strong acidic flux.
4. Do not use water-soluble *flux.
(*Water-soluble flux can be defined as non rosin type flux
including wash-type flux and non-wash-type flux.)
5. Flow Soldering
o Set temperature and time to ensure that leaching of the
outer electrode does not exceed 25% of the chip end
area as a single chip (full length of the edge A-B-C-D
shown right) and 25% of the length A-B shown below as
mounted on substrate.
[As a Single Chip]
A
B
D
C
Outer Electrode
[As Mounted on Substrate]
B
A
6. Washing
1. Please evaluate a capacitor by actual cleaning equipment
and conditions to confirm the quality and select the
applicable solvent.
2. Unsuitable cleaning solvent may leave residual flux or
other foreign substances, causing deterioration of
electrical characteristics and the reliability of the
capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or
insufficient) may result in the deterioration of the
performance of the capacitors.
Continued on the following page.
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