MC68HC908BD48 Datasheet, PDF (284/290 Pages) Freescale Semiconductor, Inc – Microcontrollers

Mechanical Specifications
22.3 28-Pin Plastic Dual In-Line Package (PDIP)
28
1
A
HG
F
15
B
14
C
N
D
K
SEATING
PLANE
L
J
M
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 36.45 37.21 1.435 1.465
B 13.72 14.22 0.540 0.560
C 3.94 5.08 0.155 0.200
D 0.36 0.56 0.014 0.022
F 1.02 1.52 0.040 0.060
G
2.54 BSC
0.100 BSC
H 1.65 2.16 0.065 0.085
J 0.20 0.38 0.008 0.015
K 2.92 3.43 0.115 0.135
L
15.24 BSC
0.600 BSC
M
0° 15°
0° 15°
N 0.51 1.02 0.020 0.040
Figure 22-1. 28-Pin PDIP (Case 710)
22.4 42-Pin Shrink Dual in-Line Package (SDIP)
–A–
42
22
–B–
1
21
C
L
H
–T–
SEATING
PLANE
F
G
D 42 PL
0.25 (0.010) ^M T A ^S
N
K
M
J 42 PL
0.25 (0.010) ^M T B ^S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 1.435 1.465 36.45 37.21
B 0.540 0.560 13.72 14.22
C 0.155 0.200 3.94 5.08
D 0.014 0.022 0.36 0.56
F 0.032 0.046 0.81 1.17
G 0.070 BSC
1.778 BSC
H 0.300 BSC
7.62 BSC
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.600 BSC
15.24 BSC
M
0° 15°
0° 15°
N 0.020 0.040 0.51 1.02
Figure 22-2. 42-Pin SDIP (Case 858)
Technical Data
284
Mechanical Specifications
MC68HC908BD48 — Rev. 1.0
MOTOROLA