PIC18F-LF1XK50 Datasheet, PDF (419/420 Pages) Microchip Technology – 20-Pin USB Flash Microcontrollers

PIC18F/LF1XK50
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
X
/XX
Device
Packaging Temperature Package
Option
Range
XXX
Pattern
Device:
Packaging Option:
Temperature
Range:
PIC18F13K50⁽¹⁾, PIC18F14K50⁽¹⁾,
PIC18LF13K50⁽¹⁾, PIC18LF14K50
Blank = Standard packaging (tube or tray)
T
= Tape and Reel⁽¹⁾
E
= -40C to +125C (Extended)
I
= -40°C to +85°C (Industrial)
Examples:
a) PIC18F14K50-E/P 301 = Extended temp.,
PDIP package, Extended VDD limits, QTP pat-
tern #301.
b) PIC18LF14K50-E/SO = Extended temp., SOIC
package.
c) PIC18LF14K50-E/P = Extended temp., PDIP
package.
d) PIC18LF14K50-E/MQ = Extended temp., QFN
package.
e) PIC18F14K50-I/P = Industrial temp., PDIP
package.
Package:
Pattern:
P = PDIP
SO = SOIC
SS = SSOP
MQ = QFN
QTP, SQTP, Code or Special Requirements
(blank otherwise)
Note 1:
Tape and Reel option is available for ML,
MV, PT, SO and SS packages with industrial
Temperature Range only.
 2010 Microchip Technology Inc.
Preliminary
DS41350E-page 419