English
Language : 

PIC18F-LF1XK50 Datasheet, PDF (369/420 Pages) Microchip Technology – 20-Pin USB Flash Microcontrollers
PIC18F/LF1XK50
27.2 DC Characteristics: PIC18F/LF1XK50-I/E (Industrial, Extended) (Continued)
PIC18LF1XK50
PIC18F1XK50
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C  TA  +125°C for extended
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +85°C for industrial
-40°C  TA  +125°C for extended
Param
No.
Device
Characteristics
Min Typ† Max Units
VDD
Conditions
Note
Supply Current (IDD)(1, 2)
D016
—
2.6
3.3
mA
3.0 FOSC = 12 MHz
EC Oscillator (high power)
D016
—
2.6
3.3
mA
3.0 FOSC = 12 MHz
—
3.1
4.1
mA
5.0 EC Oscillator (high power)(5)
D017
—
1.0
1.3
mA
3.0 FOSC = 12 MHz
EC Oscillator (high power)
CPU Idle
D017
—
1.0
1.3
mA
3.0 FOSC = 12 MHz
—
1.2
1.6
mA
5.0
EC Oscillator (high power)
CPU Idle(5)
D017A
—
9
12
mA
3.0 FOSC = 48 MHz
12 MHz EC Oscillator (high power)
PLL enabled
D017A
—
8.9
12
mA
3.0 FOSC = 48 MHz
—
11
14
mA
5.0
12 MHz EC Oscillator (high power)
PLL enabled(5)
D017B
—
3.9
5.0
mA
3.0 FOSC = 48 MHz
12 MHz EC Oscillator (high power)
PLL enabled, CPU Idle
D017B
—
3.9
5.0
mA
3.0 FOSC = 48 MHz
—
4.7
6.0
mA
5.0
12 MHz EC Oscillator (high power)
PLL enabled, CPU Idle(5)
D018
—
19
38
A
1.8 FOSC = 32 kHz
—
23
44
A
3.0 LFINTOSC Oscillator mode(3, 5)
D018
—
21
40
A
1.8 FOSC = 32 kHz
—
25
46
A
3.0 LFINTOSC Oscillator mode(3, 5)
—
26
48
A
5.0
D019
—
16
33
A
1.8 FOSC = 32 kHz
—
18
38
A
3.0 LFINTOSC Oscillator
CPU Idle
D019
—
18
35
A
1.8 FOSC = 32 kHz
—
20
40
A
3.0
LFINTOSC Oscillator
CPU Idle(5)
—
21
42
A
5.0
Supply Current (IDD)(1, 2)
* These parameters are characterized but not tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
4: FVR and BOR are disabled.
5: 330 nF capacitor on VUSB pin.
 2010 Microchip Technology Inc.
Preliminary
DS41350E-page 369