PIC18F-LF1XK50 Datasheet, PDF (377/420 Pages) Microchip Technology – 20-Pin USB Flash Microcontrollers

PIC18F/LF1XK50
27.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param
No.
Sym
Characteristic
Typ
Units
Conditions
TH01
JA Thermal Resistance Junction to Ambient 62.4
C/W 20-pin PDIP package
85.2
C/W 20-pin SOIC package
108.1
C/W 20-pin SSOP package
TBD
C/W 20-pin QFN 5x5mm package
TH02
JC Thermal Resistance Junction to Case
31.4
C/W 20-pin PDIP package
24
C/W 20-pin SOIC package
24
C/W 20-pin SSOP package
TH03
TJMAX Maximum Junction Temperature
150
C
TH04
TH05
PD Power Dissipation
PINTERNAL Internal Power Dissipation
—
W
PD = PINTERNAL + PI/O
—
W
PINTERNAL = IDD x VDD⁽¹⁾
TH06
TH07
PI/O
PDER
I/O Power Dissipation
Derated Power
—
W
PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
—
W
PDER = PDMAX (TJ - TA)/JA⁽²⁾
Legend: TBD = To Be Determined
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature
3: TJ = Junction Temperature
 2010 Microchip Technology Inc.
Preliminary
DS41350E-page 377