PIC18F-LF1XK50 Datasheet, PDF(363/420 Page) Microchip Technology – 20-Pin USB Flash Microcontrollers

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PIC18F-LF1XK50 Datasheet, PDF (363/420 Pages) Microchip Technology – 20-Pin USB Flash Microcontrollers

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PIC18F/LF1XK50

27.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings(â )

Ambient temperature under bias....................................................................................................... -40Â°C to +125Â°C

Storage temperature ........................................................................................................................ -65Â°C to +150Â°C

Voltage on VDD with respect to VSS, PIC18F1XK50 .......................................................................... -0.3V to +6.0V

Voltage on VDD with respect to VSS, PIC18LF1XK50 ........................................................................ -0.3V to +4.0V

Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V

Voltage on VUSB pin with respect to VSS ............................................................................................ -0.3V to +4.0V

Voltage on D+ and D- pins with respect to VSS ...................................................................... -0.3V to (VUSB + 0.3V)

Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ............................................................................................................................... 800 mW

Maximum current out of VSS pin ...................................................................................................................... 95 mA

Maximum current into VDD pin ......................................................................................................................... 95 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD)ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï±ï 20 mA

Maximum output current sunk by any I/O pin.................................................................................................... 25 mA

Maximum output current sourced by any I/O pin .............................................................................................. 25 mA

Maximum current sunk by all ports ................................................................................................................... 90 mA

Maximum current sourced by all ports ............................................................................................................. 90 mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD â ï¥ IOH} + ï¥ {(VDD â VOH) x IOH} + ï¥(VOl x IOL).

2: Vusb must always be ï£ VDD + 0.3V

â NOTICE: Stresses above those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for

extended periods may affect device reliability.

ï£ 2010 Microchip Technology Inc.

Preliminary

DS41350E-page 363

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