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PIC24FJ128GA310-I Datasheet, PDF (403/406 Pages) Microchip Technology – 64/80/100-Pin, General Purpose, 16-Bit Flash Microcontrollers with LCD Controller and nanoWatt XLP Technology | |||
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PIC24FJ128GA310 FAMILY
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PIC 24 FJ 128 GA3 10 T - I / PT - XXX
Microchip Trademark
Architecture
Flash Memory Family
Program Memory Size (KB)
Product Group
Pin Count
Tape and Reel Flag (if applicable)
Temperature Range
Package
Pattern
Examples:
a) PIC24FJ64GA306-I/MR:
PIC24F device with LCD Controller and nano-
Watt XLP Technology, 64 KB program memory,
64-pin, Industrial temp., QFN package.
b) PIC24FJ128GA308-I/PT:
PIC24F device with LCD Controller and nano-
Watt XLP Technology, 128 KB program
memory, 80-pin, Industrial temp., TQFP
package.
c) PIC24FJ128GA210-I/BG:
PIC24F device with LCD Controller and nano-
Watt XLP Technology, 128 KB program
memory, 121-pin, Industrial temp., BGA
package.
Architecture
24 = 16-bit modified Harvard without DSP
Flash Memory Family FJ = Flash program memory
Product Group
GA3 = General-purpose microcontrollers with
LCD Controller and nanoWatt XLP Technology
Pin Count
06 = 64-pin
08 = 80-pin
10 = 100-pin (TQFP) and 121-pin (BGA)
Temperature Range I = -40ï°C to +85ï°C (Industrial)
Package
BG = 121-pin (10x10x1.4 mm) BGA package
PT = 100-lead (12x12x1 mm) TQFP (Thin Quad Flatpack)
PF = 100-lead (14x14x1 mm) TQFP (Thin Quad Flatpack)
PT = 80-pin (12x12x1 mm) TQFP (Thin Quad Flatpack)
PT = 64-lead (10x10x1 mm) TQFP (Thin Quad Flatpack)
MR = 64-lead (9x9x0.9 mm) QFN (Quad Flatpack, No Lead)
Pattern
Three-digit QTP, SQTP, Code or Special Requirements
(blank otherwise)
ES = Engineering Sample
ï£ 2010-2011 Microchip Technology Inc.
DS39996F-page 403
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