PIC18F4321 Datasheet, PDF (377/396 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology

PIC18F4321 FAMILY
44-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
D1
E
e
E1
N
b
NOTE 1
1 23
NOTE 2
A
α
c
φ
β
A1
L
L1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
Number of Leads
N
44
Lead Pitch
e
0.80 BSC
Overall Height
A
–
–
Molded Package Thickness
A2
0.95
1.00
Standoff
A1
0.05
–
Foot Length
L
0.45
0.60
Footprint
L1
1.00 REF
Foot Angle
φ
0°
3.5°
Overall Width
E
12.00 BSC
Overall Length
D
12.00 BSC
Molded Package Width
E1
10.00 BSC
Molded Package Length
D1
10.00 BSC
Lead Thickness
c
0.09
–
Lead Width
b
0.30
0.37
Mold Draft Angle Top
α
11°
12°
Notes:
Mold Draft Angle Bottom
β
11°
12°
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
A2
MAX
1.20
1.05
0.15
0.75
7°
0.20
0.45
13°
13°
© 2007 Microchip Technology Inc.
Preliminary
DS39689E-page 375