PIC18F4321 Datasheet, PDF (373/396 Pages) Microchip Technology – 28/40/44-Pin Enhanced Flash Microcontrollers with 10-Bit A/D and nanoWatt Technology

PIC18F4321 FAMILY
28-Lead Plastic Quad Flat, No Lead Package (MM) – 6x6x0.9 mm Body [QFN-S]
with 0.40 mm Contact Length
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
EXPOSED
D2
PAD
e
E
2
1
E2
2
1
b
K
N
TOP VIEW
NOTE 1
N
L
BOTTOM VIEW
A
A3
A1
Units
MILLIMETERS
Dimension Limits
MIN
NOM
Number of Pins
N
28
Pitch
e
0.65 BSC
Overall Height
A
0.80
0.90
Standoff
A1
0.00
0.02
Contact Thickness
A3
0.20 REF
Overall Width
E
6.00 BSC
Exposed Pad Width
E2
3.65
3.70
Overall Length
D
6.00 BSC
Exposed Pad Length
D2
3.65
3.70
Contact Width
b
0.23
0.38
Contact Length
L
0.30
0.40
Notes:
Contact-to-Exposed Pad
K
0.20
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
MAX
1.00
0.05
4.70
4.70
0.43
0.50
–
Microchip Technology Drawing C04-124B
© 2007 Microchip Technology Inc.
Preliminary
DS39689E-page 371