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DS892 Datasheet, PDF (4/79 Pages) Xilinx, Inc – DC and AC Switching Characteristics
Kintex UltraScale FPGAs Data Sheet: DC and AC Switching Characteristics
Table 2: Recommended Operating Conditions(1)(2) (Cont’d)
Symbol
Description
VMGTAVTTRCAL(11)
Analog supply voltage for the resistor calibration
the GTH and GTY transceiver columns
circuit
of
SYSMON
VCCADC
VREFP
Temperature
SYSMON supply relative to GNDADC
Externally supplied reference voltage
Junction temperature operating range for commercial (C)
temperature devices
Tj
Junction temperature operating range for extended (E)
temperature devices
Junction temperature operating range for industrial (I)
temperature devices
Min
1.170
1.746
1.200
0
0
–40
Typ
1.200
1.800
1.250
–
–
–
Max
1.230
Units
V
1.854
V
1.300
V
85
°C
100
°C
100
°C
Notes:
1. All voltages are relative to ground.
2. For the design of the power distribution system consult UltraScale Architecture PCB Design Guide (UG583).
3. VCCINT_IO must be connected to VCCINT.
4. cFoonr fVigCuCrOa_t0io, nth, edamtainiismruemtairneecdomevmeennidf eVdCCoOpedrraotpinsgtovo0lVta.ge for power on and during configuration is 1.425V. After
5.
Includes
5%.
VCCO
of
1.0V
(HP
I/O
only),
1.2V,
1.35V,
1.5V,
1.8V,
2.5V
(HR
I/O
only)
at
±5%,
and
3.3V
(HR
I/O
only)
at
+3/–
6. VCCAUX_IO must be connected to VCCAUX.
7. The lower absolute voltage specification always applies.
8. See Table 12 for TMDS_33 specifications.
9. A total of 200 mA per 52-pin bank should not be exceeded.
10. VBATT is required only when using bitstream encryption. If battery is not used, connect VBATT to either ground or VCCAUX.
11. Each voltage listed requires filtering as described in UltraScale Architecture GTH Transceiver User Guide (UG576).
DS892 (v1.12) April 1, 2016
Product Specification
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