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| PIC16F1847_13 Datasheet, PDF (437/440 Pages) Microchip Technology – 18/20/28-Pin Flash Microcontrollers with XLP Technology | |||
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PIC16(L)F1847
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
[X](1) -
X
/XX
XXX
Examples:
Device Tape and Reel Temperature Package Pattern
Option
Range
Device:
Tape and Reel
Option:
Temperature
Range:
PIC16F1847
PIC16LF1847
Blank = Standard packaging (tube or tray)
T
= Tape and Reel(1)
I
= -40ï°C to +85ï°C (Industrial)
E
= -40ï°C to +125ï°C (Extended)
a) PIC16F1847 - I/ML 301
Industrial temp.,
QFN package,
QTP pattern #301
b) PIC16F1847 - I/P
Industrial temp.,
PDIP package
c) PIC16F1847 - E/SS
Extended temp.,
SSOP package
d) PIC16LF1847T - E/SO
Tape and Reel,
Extended Temp.,
SOIC package
Package:(2)
Pattern:
ML = Micro Lead Frame (QFN) 6x6
MV = Micro Lead Frame (UQFN) 4x4
P = Plastic DIP
SO = SOIC
SS = SSOP
QTP, SQTP, Code or Special Requirements
(blank otherwise)
Note 1:
2:
Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and is
not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
For other small form-factor package
availability and marking information, please
visit www.microchip.com/packaging or
contact your local sales office.
ï£2011-2013 Microchip Technology Inc.
Preliminary
DS40001453D-page 437
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