PIC16F1847_13 Datasheet, PDF(345/440 Page) Microchip Technology – 18/20/28-Pin Flash Microcontrollers with XLP Technology

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PIC16F1847_13 Datasheet, PDF (345/440 Pages) Microchip Technology – 18/20/28-Pin Flash Microcontrollers with XLP Technology

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PIC16(L)F1847

30.0 ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings(â )

Ambient temperature under bias....................................................................................................... -40Â°C to +125Â°C

Storage temperature ........................................................................................................................ -65Â°C to +150Â°C

Voltage on VDD with respect to VSS, PIC16F1847 ............................................................................. -0.3V to +6.5V

Voltage on VDD with respect to VSS, PIC16LF1847 ........................................................................... -0.3V to +4.0V

Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V

Voltage on all other pins with respect to VSS ........................................................................... -0.3V to (VDD + 0.3V)

Total power dissipation(1) ............................................................................................................................... 800 mW

Maximum current out of VSS pin, -40Â°C ï£ TA ï£ +85Â°C for industrial............................................................... 170 mA

Maximum current out of VSS pin, -40Â°C ï£ TA ï£ +125Â°C for extended .............................................................. 70 mA

Maximum current into VDD pin, -40Â°C ï£ TA ï£ +85Â°C for industrial.................................................................. 170 mA

Maximum current into VDD pin, -40Â°C ï£ TA ï£ +125Â°C for extended ................................................................. 70 mA

Clamp current, IK (VPIN < 0 or VPIN > VDD)ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï®ï±ï 20 mA

Maximum output current sunk by any I/O pin.................................................................................................... 25 mA

Maximum output current sourced by any I/O pin .............................................................................................. 25 mA

Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD â ï¥ IOH} + ï¥ {(VDD â VOH) x IOH} + ï¥(VOl x

IOL).

â NOTICE: Stresses above those listed under âAbsolute Maximum Ratingsâ may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

ï£ 2011-2013 Microchip Technology Inc.

Preliminary

DS40001453D-page 345

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