PIC16F1847_13 Datasheet, PDF (357/440 Pages) Microchip Technology – 18/20/28-Pin Flash Microcontrollers with XLP Technology

PIC16(L)F1847
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  TA  +125°C
Param.
No.
Sym.
Characteristic
Typ.
Units
Conditions
TH01
JA Thermal Resistance Junction to Ambient 65.5
C/W 18-pin PDIP package
76.0
C/W 18-pin SOIC package
87.3
C/W 20-pin SSOP package
31.1
C/W 28-pin QFN (6x6mm) package
52.5
C/W 28-pin UQFN (4x4mm) package
TH02
JC Thermal Resistance Junction to Case
29.5
C/W 18-pin PDIP package
23.5
C/W 18-pin SOIC package
31.1
C/W 20-pin SSOP package
5.0
C/W 28-pin QFN (6x6mm) package
9.5
C/W 28-pin UQFN (4x4mm) package
TH03
TJMAX Maximum Junction Temperature
150
C
TH04
PD Power Dissipation
—
W
PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation
—
W
PINTERNAL = IDD x VDD (Note 1)
TH06
PI/O I/O Power Dissipation
—
W
PI/O =  (IOL * VOL) +  (IOH * (VDD - VOH))
TH07
PDER Derated Power
—
W
PDER = PDMAX (TJ - TA)/JA (Note 2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature; TJ = Junction Temperature.
 2011-2013 Microchip Technology Inc.
Preliminary
DS40001453D-page 357