PIC17C7XX_13 Datasheet, PDF (286/306 Pages) Microchip Technology – High-Performance 8-bit CMOS EPROM Microcontrollers with 10-bit A/D

PIC17C7XX
84-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
#leads=n1
D1 D
n12
CH2 x 45
CH1 x 45 

A2
A3
A
32
c

B1
B
p
A1
D2
E2
Units
INCHES*
MILLIMETERS
Dimension Limits MIN
NOM
MAX
MIN
NOM
Number of Pins
n
68
68
Pitch
p
.050
1.27
Pins per Side
n1
17
17
Overall Height
A
.165
.173
.180
4.19
4.39
Molded Package Thickness
A2
.145
.153
.160
3.68
3.87
Standoff §
A1
.020
.028
.035
0.51
0.71
Side 1 Chamfer Height
A3
.024
.029
.034
0.61
0.74
Corner Chamfer 1
CH1
.040
.045
.050
1.02
1.14
Corner Chamfer (others)
CH2
.000
.005
.010
0.00
0.13
Overall Width
E
.985
.990
.995
25.02
25.15
Overall Length
D
.985
.990
.995
25.02
25.15
Molded Package Width
E1
.950
.954
.958
24.13
24.23
Molded Package Length
D1
.950
.954
.958
24.13
24.23
Footprint Width
E2
.890
.920
.930
22.61
23.37
Footprint Length
D2
.890
.920
.930
22.61
23.37
Lead Thickness
c
.008
.011
.013
0.20
0.27
Upper Lead Width
B1
.026
.029
.032
0.66
0.74
Lower Lead Width
B
.013
.020
.021
0.33
0.51
Mold Draft Angle Top

0
5
10
0
5
Mold Draft Angle Bottom

0
5
10
0
5
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-093
MAX
4.57
4.06
0.89
0.86
1.27
0.25
25.27
25.27
24.33
24.33
23.62
23.62
0.33
0.81
0.53
10
10
DS30289C-page 286
 1998-2013 Microchip Technology Inc.