PIC17C7XX_13 Datasheet, PDF (285/306 Pages) Microchip Technology – High-Performance 8-bit CMOS EPROM Microcontrollers with 10-bit A/D

PIC17C7XX
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
#leads=n1
p
D1 D
2
B
1
n
CH x 45
A

c


A2
L
A1
(F)
Units
Dimension Limits
Number of Pins
n
Pitch
p
Pins per Side
n1
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Foot Length
L
Footprint (Reference)
(F)
Foot Angle

Overall Width
E
Overall Length
D
Molded Package Width
E1
Molded Package Length
D1
Lead Thickness
c
Lead Width
B
Pin 1 Corner Chamfer
CH
Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter
§ Significant Characteristic
MIN
.039
.037
.002
.018
0
.541
.541
.463
.463
.004
.007
.025
5
5
INCHES
NOM
80
.020
20
.043
.039
.004
.024
.039
3.5
.551
.551
.472
.472
.006
.009
.035
10
10
MAX
.047
.041
.006
.030
7
.561
.561
.482
.482
.008
.011
.045
15
15
MILLIMETERS*
MIN
NOM
80
0.50
20
1.00
1.10
0.95
1.00
0.05
0.10
0.45
0.60
1.00
0
3.5
13.75
14.00
13.75
14.00
11.75
12.00
11.75
12.00
0.09
0.15
0.17
0.22
0.64
0.89
5
10
5
10
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
MAX
1.20
1.05
0.15
0.75
7
14.25
14.25
12.25
12.25
0.20
0.27
1.14
15
15
 1998-2013 Microchip Technology Inc.
DS30289C-page 285