PIC17C75X Datasheet, PDF (226/320 Pages) Microchip Technology – High-Performance 8-Bit CMOS EPROM Microcontrollers

PIC17C75X
20.2 DC CHARACTERISTICS:
PIC17LC752/756 (Commercial, Industrial)
PIC17LC752/756 (Commercial, Industrial)
DC CHARACTERISTICS
Param.
No.
Sym
Characteristic
Standard Operating Conditions (unless otherwise stated)
Operating temperature
-40˚C ≤ TA ≤ +85˚C for industrial and
0˚C ≤ TA ≤ +70˚C for commercial
Min Typ† Max Units
Conditions
D001
D002
D003
D004
VDD Supply Voltage
3.0 – 6.0 V
VDR RAM Data Retention 1.5 * – –
Voltage (Note 1)
V Device in SLEEP mode
VPOR VDD start voltage to
–
VSS –
ensure internal
Power-on Reset signal
V See section on Power-on Reset for
details
SVDD
VDD rise rate to
ensure proper
operation
0.010 * –
– V/ms See section on Power-on Reset for
details
D005
VBOR Brown-out Reset
voltage trip point
3.6 – 4.3 V
D006
VPORTP Power-on reset trip
point
– 1.8 –
V VDD = VPORTP
D010 IDD
D011
D014
Supply Current
(Note 2)
–
3 6 * mA FOSC = 4 MHz (Note 4)
–
6 12 mA FOSC = 8 MHz
–
85 150 µA FOSC = 32 kHz,
(EC osc configuration)
D021 IPD
Power-down Current
(Note 3)
–
<1 5
µA VDD = 5.5V, WDT disabled
Module Differential
Current
D023 ∆IBOR BOR circuitry
– 300 500 µA VDD = 4.5V, BODEN enabled
D024 ∆IWDT Watchdog Timer
–
10 35 µA VDD = 5.5V
D026 ∆IAD A/D converter
–
1
–
µA VDD = 5.5V, A/D not converting
*
These parameters are characterized but not tested.
† Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to VDD or VSS, T0CKI = VDD, MCLR
= VDD; WDT disabled.
Current consumed from the oscillator and I/O’s driving external capacitive or resistive loads needs to be con-
sidered.
For the RC oscillator, the current through the external pull-up resistor (R) can be estimated as: VDD / (2 • R).
For capacitive loads, the current can be estimated (for an individual I/O pin) as (CL • VDD) • f
CL = Total capacitive load on the I/O pin; f = average frequency the I/O pin switches.
The capacitive currents are most significant when the device is configured for external execution (includes
extended microcontroller mode).
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS.
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
mated by the formula IR = VDD/2Rext (mA) with Rext in kOhm.
DS30264A-page 226
Preliminary
© 1997 Microchip Technology Inc.