TC1163 Datasheet, PDF (130/134 Pages) Infineon Technologies AG – 32-Bit Single-Chip Microcontroller TriCore

TC1163/TC1164
Preliminary
Package and Reliability
5
Package and Reliability
Chapter 5 provides the information of the TC1163/TC1164 package and reliability
section.
5.1
Package Parameters (PG-LQFP-176-2)
Table 5-1 provides the thermal characteristics of the package.
Table 5-1 Thermal Characteristics of the Package
Parameter
Symbol
Limit Values Unit Notes
Min. Max.
Thermal resistance junction R_TJCT CC –
case top¹⁾
5.4
K/W –
Thermal resistance junction R_TJL CC –
leads¹⁾
21.5 K/W –
1) The thermal resistances between the case top and the ambient (R_TCAT), the leads and the ambient (R_TLA) are
to be combined with the thermal resistances between the junction and the case top (R_TJCT ), the junction and
the leads (R_TJL) given above, in order to calculate the total thermal resistance between the junction and the
ambient (R_TJA). The thermal resistances between the case top and the ambient (R_TCAT ), the leads and the
ambient (R_TLA) depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation: T_J=T_A+R_TJA × P_D, where the R_TJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance R_TJA
can be obtained from the upper four partial thermal resistances.
Data Sheet
126
V1.0, 2008-04