33742_08 Datasheet, PDF (68/70 Pages) Freescale Semiconductor, Inc – System Basis Chip with Enhanced High Speed CAN Transceiver

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
80
70
60
50
40
30
20
x R_θJA
10
0
0
300
600
Heat spreading area A [mm²]
Figure 40. Device on Thermal Test Board R_θJA
100
10
x R_θJA
1
0.1
1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02 1.00E+03 1.00E+04
Time[s]
Figure 41. Transient Thermal Resistance R_θJA,
1 W Step response, Device on Thermal Test Board Area A = 600 (mm²)
33742
68
Analog Integrated Circuit Device Data
Freescale Semiconductor