33742_08 Datasheet, PDF (67/70 Pages) Freescale Semiconductor, Inc – System Basis Chip with Enhanced High Speed CAN Transceiver

ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
RXD ¹
TXD ²
VDD ³
RST ⁴
INT ⁵
GND ⁶
GND ⁷
GND ⁸
GND ⁹
V2 ¹⁰
V2CTRL ¹¹
VSUP ¹²
HS ¹³
L0 ¹⁴
28 _WDOG
27 _CS
26 _MOSI
25 _MISO
24 _SCLK
23 _GND
22 _GND
21 _GND
20 _GND
19 _CANL
18 _CANH
17 _L3
16 _L2
15 _L1
33742 Pin Connections
28-Pin SOICW
1.27 mm Pitch
18.0 mm x 7.5 mm Body
A
Figure 39. Thermal Test Board
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6mm thickness
Cu traces, 0.07mm thickness
Outline:
80mm x 100mm board area,
including edge connector for thermal
testing
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions: Natural convection, still air
Table 44. Thermal Resistance Performance
A [mm²]
0
300
600
R_θJA [°C/W]
68
52
47
R_θJA is the thermal resistance between die junction and
ambient air.
Analog Integrated Circuit Device Data
Freescale Semiconductor
33742
67