TLK111_14 Datasheet, PDF (84/110 Pages) Texas Instruments – PHYTER® Industrial Temperature 10/100Mbs Ethernet Physical Layer Transceiver

TLK111
SLLSEF8B – AUGUST 2013 – REVISED JANUARY 2014
9 Electrical Specifications
All parameters are derived by test, statistical analysis, or design.
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9.1 ABSOLUTE MAXIMUM RATINGS⁽¹⁾
VDD_IO, AVDD33
PFBIN1, PFBIN2
XI
TD-, TD+, RD-, RD+
Other Inputs
XO
Other outputs
T_J
T_S
ESD
Supply voltage
DC Input voltage
DC Output voltage
Maximum die temperature
Storage Temperature
Human-Body
Model
All pins⁽²⁾
Ethernet network pins (TD+, TD-, RD+, RD-)⁽³⁾
Charged-Device
Model
All pins⁽⁴⁾
VALUE
–0.3 to 3.8
–0.3 to 1.8
–0.3 to 3.8
–0.3 to 6
–0.3 to 3.8
–0.3 to 3.8
–0.3 to 3.8
125
–65 to 150
±4
±16
±750
UNIT
V
V
V
°C
°C
kV
V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Tested in accordance to JEDEC Standard 22, Test Method A114.
(3) Test method based upon JEDEC Standard 22 Test Method A114, Ethernet network pins (TD+, TD-, RD+, RD-) pins stressed with
respect to GND.
(4) Tested in accordance to JEDEC Standard 22, Test Method C101.
9.2 RECOMMENDED OPERATING CONDITIONS
MIN
Dual Supply Operation
Core Supply voltage (PFBIN1, PFBIN2)
1.48
P_D
Power dissipation⁽¹⁾
Single Supply Operation
(PFBOUT connected to PFBIN1, PFBIN2 See Figure 3-1)
P_D
Power dissipation⁽²⁾
AVDD33
Analog 3.3V Supply
3.0
3.3V Option
3.0
VDD_IO
2.5V Option
2.25
1.8V Option (MII Mode only)
1.62
T_A
Ambient
TLK111PT
–40
temperature ⁽³⁾
TLK111PTB
–40
P_D
Power dissipation⁽²⁾
200
(1) For 100Base-TX
(2) For 100Base-TX, When internal 1.55V is used. Device is operated from single 3.3V supply only.
(3) Provided that DOWN_PAD, pin 49, is soldered down. See Thermal Vias Recommendation for more detail.
NOM
1.55
200
270
3.3
3.3
2.5
1.8
MAX UNIT
1.68 V
mW
mW
3.6 V
3.6
2.75 V
1.98
85
°C
125
mW
9.3 48-Pin Industrial Device Thermal Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITIONS
θ_JA
Junction-to-ambient thermal resistance (no airflow)
θ_JB
Junction-to-board thermal resistance
θ_JC
Junction-to-case thermal resistance
JEDEC high-K model
MIN
TYP
MAX UNIT
65.3
28.5
°C/W
23.1
84
Electrical Specifications
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