LM3S101 Datasheet, PDF (436/445 Pages) List of Unclassifed Manufacturers – Microcontroller

Package Information
D
D.1
D.1.1
Package Information
28-Pin SOIC Package
Package Dimensions
Figure D-1. Stellaris LM3S101 28-Pin SOIC Package¹
Note: The following notes apply to the package drawing.
1. Dimension "D" does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions,
and gate burrs shall not exceed .006" (0.15 mm) per side.
2. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusion
shall not exceed .010" (0.25 mm) per side.
3. "L" is the length of terminal for soldering to a substrate.
4. "N" is the number of terminal positions.
5. Terminal numbers are shown for reference only.
6. The lead width "B", as measured .014" (0.36 mm) or greater above the seating plane, shall not
exceed a maximum value of .024" (0.61 mm).
7. Reference drawing JEDEC MS013, Variation AE.
1_{OBSOLETE: TI has discontinued production of this device.}
436
Texas Instruments-Production Data
July 14, 2014