SM320F28335PTPMEP Datasheet, PDF (160/167 Pages) Texas Instruments – Digital Signal Controller (DSC)

SM320F28335-EP
SPRS581D – JUNE 2009 – REVISED MAY 2012
www.ti.com
Table 7-4. Thermal Model 176-pin PTP Results
NO.
°C/W ⁽¹⁾
°C/W ⁽²⁾
°C/W⁽³⁾ °C/W⁽⁴⁾
AIR FLOW
(m/s) ⁽⁵⁾
1 Rθ_JC
2 Rθ_JB
3 Rθ_JA
4
Junction-to-case
Junction-to-board
Junction-to-free air
7.8
9.4
8.6
10.1
N/A
6.2
9.9
7.1
10.6
N/A
21.3
27.9
23.2
30.6
0
14.3
20.2
22.6
0.5
5
6
Rθ_JMA
Junction-to-moving air
13.1
18.6
12.1
17.4
21
1
19.6
2
7
11.2
16.2
18.2
4
8
0.5
0.7
0.8
0
9
0.6
0.9
1
0.5
10 Psi_JT
11
Junction-to-package top
0.7
1
0.8
1.1
1.1
1
1.3
2
12
1
1.3
1.5
4
13
6.3
9.5
10.8
0
14
5.9
8.8
9.9
0.5
15 Psi_JB
16
Junction-to-board
5.9
8.7
5.8
8.6
9.8
1
9.7
2
17
5.8
8.5
9.6
4
(1) Simulation data, using a model of a JEDEC defined 2S2P system with a 12 x 12-mm copper pad on the top and bottom copper layers
connected with an 8 x 8 thermal via array and soldered to the package thermal pad. Power dissipation of 1 W assumed, 70°C Ambient
temp assumed. Signal layer copper coverage 20%, inner layer copper coverage 90%. Actual performance will change based on
environment as well as application. For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal
Test Method Environment Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for
Leaded Surface Mount Packages.
(2) Simulation data, using the same model but with 1 oz. (35 μm) top and bottom copper thickness and 0.5 oz. (18 μm) inner copper
thickness. Power dissipation of 1 W and ambient temp of 70°C assumed.
(3) Simulation data, 1S1P PCB model with 12 x 12-mm copper pad on the top layer soldered to device thermal pad and connected to the
bottom copper layer (90% copper) with an 8 x 8 thermal via array. Power dissipation of 1 W and ambient temp of 70°C assumed.
Copper thickness 2 oz. (70 μm) top and bottom.
(4) Simulation data, 1S1P PCB model with 12 x 12-mm copper pad on the top layer soldered to device thermal pad and connected to the
bottom copper layer (90% copper) with an 8 x 8 thermal via array. Power dissipation of 1 W and ambient temp of 70°C assumed.
Copper thickness 1 oz. (35 μm) top and bottom.
(5) m/s = meters per second
160 Thermal/Mechanical Data
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