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IC43R16160 Datasheet, PDF (4/56 Pages) Integrated Circuit Solution Inc – 4M x 16 Bit x 4 Banks (256-MBIT) DDR SDRAM
IC43R16160
Block Diagram
Column address
counter
16M x 16
Column Addresses
A0 - A8, AP, BA0, BA1
Row Addresses
A0 - A12, BA0, BA1
Column address
buffer
Row address
buffer
Row decoder
Memory array
Bank 0
8192 x 256
x32 bit
Row decoder
Memory array
Bank 1
8192 x 256
x 32 bit
Row decoder
Memory array
Bank 2
8192 x 256
x 32 bit
Refresh Counter
Row decoder
Memory array
Bank 3
8192 x 256
x 32 bit
Input buffer Output buffer
Control logic & timing generator
CK, CK
DLL
DQ0-DQ15
DQS
Strobe
Gen.
Data Strobe
Capacitance*
TA = 0 to 70°C, VCC = 2.5V ± 0.2V, VCC = 2.6V ± 0.1V
for DDR400, f = 1 Mhz
Input Capacitance
Symbol Min Max Unit
BA0, BA1, CKE, CS, RAS, (CAS,
A0-A11, WE)
CINI
2 3.0 pF
Input Capacitance (CK, CK)
Data & DQS I/O Capacitance
Input Capacitance (DM)
CIN2 2 3.0 pF
COUT 4 5 pF
CIN3 4 5.0 pF
*Note: Capacitance is sampled and not 100% tested.
Absolute Maximum Ratings*
Operating temperature range ..................0 to 70 °C
Storage temperature range ................-55 to 150 °C
VDDSupply Voltage Relative to VSS.....-1V to +3.6V
VDDQ Supply Voltage Relative to VSS
......................................................-1V to +3.6V
VREF and Inputs Voltage Relative to VSS
......................................................-1V to +3.6V
I/O Pins Voltage Relative to VSS
.......................................... -0.5V to VDDQ+0.5V
Power dissipation .......................................... 1.6 W
Data out current (short circuit) ...................... 50 mA
*Note: Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage of the device.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
4
Integrated Circuit Solution Inc.
DDR001-0B 11/10/2004