IC43R16160 Datasheet, PDF (36/56 Pages) Integrated Circuit Solution Inc – 4M x 16 Bit x 4 Banks (256-MBIT) DDR SDRAM

IC43R16160
3. Outputs measured with equivalent load:
Output
(V_OUT)
V_TT
50Ω
Reference
Point
30pF
NOTES: (continued)
4. AC timing and IDD tests may use a VIL-to-VIH swing of up to 1.5V in the test environment, but input
timing is still referenced to VREF (or to the crossing point for CK/CK), and parameter specifications
are guaranteed for the specified AC input levels under normal use conditions. The minimum slew rate
for the input signals used to test the device is 1V/ns in the range between VIL(AC) and VIH(AC).
5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e., the receiver will
effectively switch as a result of the signal crossing the AC input level, and will remain in that state as long
as the signal does not ring back above [below] the DC input LOW [HIGH] level).
6. VREF is expected to equal VDDQ/2 of the transmit-ting device and to track variations in the DC level
of the same. Peak-to-peak noise (non-common mode) on VREF may not exceed ±2 percent of the DC value.
Thus, from VDDQ/2, VREF is allowed ±25mV for DC error and an additional ±25mV for AC noise.
7. VTT is not applied directly to the device. VTT is a system supply for signal termination resistors, is expected
to be set equal to VREF and must track variations in the DC level of VREF.
8. VID is the magnitude of the difference between the input level on CK and the input level on CK.
9. The value of VIX is expected to equal VDDQ/2 of the transmitting device and must track varia-tions in the
DC level of the same.
10. IDD is dependent on output loading and cycle rates. Specified values are obtained with minimum cycle
time at CL = 2 for -6, -7 .
11. Enables on-chip refresh and address counters.
12. IDD specifications are tested after the device is properly initialized, and is averaged at the defined cycle rate.
13. This parameter is sampled. VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V, VREF = VSS, f = 100 MHz, T A = 25°C,
VOUT(DC) = VDDQ/2, VOUT (peak to peak) = 0.2V. DM input is grouped with I/O pins, reflecting the fact that they
are matched in loading.
14. Command/Address input slew rate = 0.5V/ns. For -5, -6, -7 and -75 with slew rates 1V/ns and faster, ^tIS and ^tIH
are reduced to 900ps. If the slew rate is less than 0.5V/ns, timing must be derated: ^tIS and ^tIH has an additional 50ps
per each 100mV/ns reduction in slew rate from the 500mV/ns. If the slew rate exceeds 4.5V/ns, functionality is un-
certain.
15. The CK/CK input reference level (for timing referenced to CK/CK) is the point at which CK and CK cross; the input
reference level for signals other than CK/CK is VREF.
16. Inputs are not recognized as valid until VREF stabilizes. Exception: during the period before VREF stabilizes,
CKE •0.3 x VDDQ is recognized as LOW.
17. The output timing reference level, as measured at the timing reference point indicated in Note 3, is VTT.
18. ^tHZ and ^tLZ transitions occur in the same access time windows as valid data transitions. These parameters
are not referenced to a specific voltage level, but specify when the device output is no longer driving (HZ) or begins
driving (LZ).
19. The maximum limit for this parameter is not a device limit. The device will operate with a greater value for this
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Integrated Circuit Solution Inc.
DDR001-0B 11/10/2004