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MC9S12C Datasheet, PDF (643/680 Pages) Motorola, Inc – 16-Bit Microcontroller
Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics(1)
Num C
Rating
Symbol
Min
Typ
Max Unit
1
T Thermal Resistance LQFP48, single layer PCB(2)
θJA
2
T
Thermal Resistance LQFP48, double sided PCB
with 2 internal planes(3)
θJA
3
T Junction to Board LQFP48
θJB
4
T Junction to Case LQFP48
θJC
5
T Junction to Package Top LQFP48
ΨJT
6
T Thermal Resistance LQFP52, single sided PCB
θJA
7
T
Thermal Resistance LQFP52, double sided PCB
with 2 internal planes
θJA
8
T Junction to Board LQFP52
θJB
9
T Junction to Case LQFP52
θJC
10
T Junction to Package Top LQFP52
ΨJT
11
T Thermal Resistance QFP 80, single sided PCB
θJA
12
T
Thermal Resistance QFP 80, double sided PCB
with 2 internal planes
θJA
13
T Junction to Board QFP80
θJB
14
T Junction to Case QFP80
θJC
15
T Junction to Package Top QFP80
ΨJT
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
—
—
69
oC/W
—
—
53
oC/W
—
—
30
oC/W
—
—
20
oC/W
—
—
4
oC/W
—
—
65
oC/W
—
—
49
oC/W
—
—
31
oC/W
—
—
17
oC/W
—
—
3
oC/W
—
—
52
oC/W
—
—
42
oC/W
—
—
28
oC/W
—
—
18
oC/W
—
—
4
oC/W
Freescale Semiconductor
MC9S12C-Family / MC9S12GC-Family
643
Rev 01.23