MC9S12C Datasheet, PDF (643/680 Pages) Motorola, Inc – 16-Bit Microcontroller

Appendix A Electrical Characteristics
Table A-5. Thermal Package Characteristics⁽¹⁾
Num C
Rating
Symbol
Min
Typ
Max Unit
1
T Thermal Resistance LQFP48, single layer PCB⁽²⁾
θ_JA
2
T
Thermal Resistance LQFP48, double sided PCB
with 2 internal planes⁽³⁾
θ_JA
3
T Junction to Board LQFP48
θ_JB
4
T Junction to Case LQFP48
θ_JC
5
T Junction to Package Top LQFP48
Ψ_JT
6
T Thermal Resistance LQFP52, single sided PCB
θ_JA
7
T
Thermal Resistance LQFP52, double sided PCB
with 2 internal planes
θ_JA
8
T Junction to Board LQFP52
θ_JB
9
T Junction to Case LQFP52
θ_JC
10
T Junction to Package Top LQFP52
Ψ_JT
11
T Thermal Resistance QFP 80, single sided PCB
θ_JA
12
T
Thermal Resistance QFP 80, double sided PCB
with 2 internal planes
θ_JA
13
T Junction to Board QFP80
θ_JB
14
T Junction to Case QFP80
θ_JC
15
T Junction to Package Top QFP80
Ψ_JT
1. The values for thermal resistance are achieved by package simulations
2. PC Board according to EIA/JEDEC Standard 51-2
3. PC Board according to EIA/JEDEC Standard 51-7
—
—
69
o_C/W
—
—
53
o_C/W
—
—
30
o_C/W
—
—
20
o_C/W
—
—
4
o_C/W
—
—
65
o_C/W
—
—
49
o_C/W
—
—
31
o_C/W
—
—
17
o_C/W
—
—
3
o_C/W
—
—
52
o_C/W
—
—
42
o_C/W
—
—
28
o_C/W
—
—
18
o_C/W
—
—
4
o_C/W
Freescale Semiconductor
MC9S12C-Family / MC9S12GC-Family
643
Rev 01.23