LSM9DS0 Datasheet, PDF (71/74 Pages) STMicroelectronics – iNEMO inertial module 3D accelerometer, 3D gyroscope, 3D magnetometer

LSM9DS0
9
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Table 133. LGA 4x4x1 mm 24-lead mechanical data (see note 1 and 2)
Databook
Symbol
Min.
Typ.
Max.
Note
A
1.070
A1
0.000
-
0.050
4
b
0.200
7
D
4.000
6
D2
1.750
E
4.000
6
E2
1.750
e1
0.500
e2
2.500
L
0.350
7
L1
-
0.100
-
L2
-
0.100
-
N
24
5
R1
-
0.080
-
Note:
Symbol
D/E
Notes
REF
Tolerance of Form and Position
Databook
0.15
1 and 2
-
Δ
1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters.
3. The “Pin 1 Indicator” is identified on top and/or bottom surfaces of the package.
4. A1 is defined as the distance from the seating plane to the land.
5. “N” is the maximum number of terminal positions for the specified body size.
6. The tolerance of the typical value is specified in table "Tolerance of Form and Position".
7. Dimensions “b” and “L” are specified:
For solder mask defined: at terminal plating surface
For non-solder mask defined: at solder mask opening
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