JN516X Datasheet, PDF (90/94 Pages) NXP Semiconductors – IEEE802.15.4 Wireless Microcontroller

Component
Designator
C13
C14
C16
C15
C2
C3
C4
C6
C7
R1
C20
Y1
Value/Type
10µF
100nF
100nF
100nF
10nF
100nF
47pF
100nF
100nF
43k
100nF
32MHz
C10
15pF +/-5% COG
C11
15pF +/-5% COG
C1
47pF
L1
5.1nH
L2
3.9nH
Function
PCB Layout Constraints
Power source decoupling
Analogue Power decoupling Adjacent to U1 pin 9
Digital power decoupling
Adjacent to U1 pin 30
VB Synth decoupling
Less than 5mm from U1 pin 6
VB VCO decoupling
Less than 5mm from U1 pin 8
VB RF decoupling
Less than 5mm from U1 pin 12 and U1 pin 14
VB RF decoupling
Less than 5mm from U1 pin 12 and U1 pin 14
VB RAM decoupling
Less than 5mm from U1 pin 25
VB Dig decoupling
Less than 5mm from U1 pin 35
Current Bias Resistor
Less than 5mm from U1 pin 10
Vref decoupling (optional) Less than 5mm from U1 pin 11
Crystal (AEL X32M000000S039 or Epson Toyocom X1E000021016700)
(CL = 9pF, Max ESR 40R)
Crystal Load Capacitor
Adjacent to pin 4 and Y1 pin 1
Crystal Load Capacitor
Adjacent to pin 5 and Y1 pin 3
AC Coupling
Phycomp 2238-869-15479
Must be copied directly from the reference design.
RF Matching Inductor
MuRata LQP15MN5N1B02
Load Inductor
MuRata LQP15MN3N9B02
Table 12: JN516x Printed Antenna Reference Module Components and PCB Layout Constraints
Note1: For extended temperature operation please contact technical support.
The paddle should be connected directly to ground. Any pads that require connection to ground should do so by
connecting directly to the paddle.
90
JN-DS-JN516x v1.1 Production
© NXP Laboratories UK 2013