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| JN516X Datasheet, PDF (82/94 Pages) NXP Semiconductors – IEEE802.15.4 Wireless Microcontroller | |||
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A.5.3 Reel Information: 330mm Reel
Surface Resistivity
Material
Between 10e9 â 10e11 Ohms Square
High Impact Polystyrene with Antistatic Additive
All dimensions and tolerances are fully compliant with EIA-481-B and are specified in millimetres.
3 window design to allow adequate labelling space.
Figure 50: 330mm Reel Dimensions
A.5.4 Dry Pack Requirement for Moisture Sensitive Material
Moisture sensitive material, as classified by JEDEC standard J-STD-033, must be dry packed. The 40 lead QFN
package is MSL2A/260°C, and is dried before sealing in a moisture barrier bag (MBB) with desiccant bag weighing at
67.5 grams of activated clay and a humidity indicator card (HIC) meeting MIL-L-8835 specification. The MBB has a
moisture-sensitivity caution label to indicate the moisture-sensitive classification of the enclosed devices.
82
JN-DS-JN516x v1.1 Production
© NXP Laboratories UK 2013
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