DS1035 Datasheet, PDF (79/106 Pages) Dallas Semiconductor – 3-in-1 High.Speed Silicon Delay Line

Pinout Information
MachXO2 Family Data Sheet
Pin Information Summary
MachXO2-256
MachXO2-640 MachXO2-640U
32 QFN¹ 64 ucBGA 100 TQFP 132 csBGA 100 TQFP 132 csBGA 144 TQFP
General Purpose I/O per Bank
Bank 0
8
9
13
13
18
19
27
Bank 1
2
12
14
14
20
20
26
Bank 2
9
11
14
14
20
20
28
Bank 3
2
12
14
14
20
20
26
Bank 4
0
0
0
0
0
0
0
Bank 5
0
0
0
0
0
0
0
Total General Purpose Single Ended
I/O
21
44
55
55
78
79
107
Differential I/O per Bank
Bank 0
4
5
7
7
9
10
14
Bank 1
1
6
7
7
10
10
13
Bank 2
4
5
7
7
10
10
14
Bank 3
1
6
7
7
10
10
13
Bank 4
0
0
0
0
0
0
0
Bank 5
0
0
0
0
0
0
0
Total General Purpose Differential I/O 10
22
28
28
39
40
54
Dual Function I/O
22
27
29
29
29
29
33
High-speed Differential I/O
Bank 0
0
0
0
0
0
0
7
Gearboxes
Number of 7:1 or 8:1 Output Gearbox
Available (Bank 0)
0
0
0
0
0
0
7
Number of 7:1 or 8:1 Input Gearbox
Available (Bank 2)
0
0
0
0
0
0
7
DQS Groups
Bank 1
0
0
0
0
0
0
2
VCCIO Pins
Bank 0
Bank 1
Bank 2
Bank 3
Bank 4
Bank 5
2
2
2
2
2
2
3
1
2
2
2
2
2
3
2
2
2
2
2
2
3
1
2
2
2
2
2
3
0
0
0
0
0
0
0
0
0
0
0
0
0
0
VCC
2
2
2
2
2
2
4
GND
2
8
8
8
8
10
12
NC
0
1
26
58
3
32
8
Total Count of Bonded Pins
31
62
73
73
96
99
135
1. Lattice recommends soldering the central thermal pad onto the top PCB ground for improved thermal resistance.
4-3