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DS1035 Datasheet, PDF (104/106 Pages) Dallas Semiconductor – 3-in-1 High.Speed Silicon Delay Line
MachXO2 Family Data Sheet
Revision History
January 2013
Data Sheet DS1035
Date
November 2010
January 2011
Version
01.0
01.1
April 2011
01.2
May 2011
01.3
Section
—
All
DC and Switching
Characteristics
Pinout Information
—
Introduction
Architecture
DC and Switching
Characteristics
Ordering Information
Multiple
DC and Switching
Characteristics
Pinout Information
Change Summary
Initial release.
Included ultra-high I/O devices.
Recommended Operating Conditions table – Added footnote 3.
DC Electrical Characteristics table – Updated data for IIL, IIH. VHYST typ-
ical values updated.
Generic DDRX2 Outputs with Clock and Data Aligned at Pin
(GDDRX2_TX.ECLK.Aligned) Using PCLK Pin for Clock Input tables –
Updated data for TDIA and TDIB.
Generic DDRX4 Outputs with Clock and Data Aligned at Pin
(GDDRX4_TX.ECLK.Aligned) Using PCLK Pin for Clock Input tables –
Updated data for TDIA and TDIB.
Power-On-Reset Voltage Levels table - clarified note 3.
Clarified VCCIO related recommended operating conditions specifica-
tions.
Added power supply ramp rate requirements.
Added Power Supply Ramp Rates table.
Updated Programming/Erase Specifications table.
Removed references to VCCP.
Included number of 7:1 and 8:1 gearboxes (input and output) in the pin
information summary tables.
Removed references to VCCP.
Data sheet status changed from Advance to Preliminary.
Updated MachXO2 Family Selection Guide table.
Updated Supported Input Standards table.
Updated sysMEM Memory Primitives diagram.
Added differential SSTL and HSTL IO standards.
Updates following parameters: POR voltage levels, DC electrical char-
acteristics, static supply current for ZE/HE/HC devices, static power
consumption contribution of different components – ZE devices, pro-
gramming and erase Flash supply current.
Added VREF specifications to sysIO recommended operating condi-
tions.
Updating timing information based on characterization.
Added differential SSTL and HSTL IO standards.
Added Ordering Part Numbers for R1 devices, and devices in WLCSP
packages.
Added R1 device specifications.
Replaced “SED” with “SRAM CRC Error Detection” throughout the doc-
ument.
Added footnote 1 to Program Erase Specifications table.
Updated Pin Information Summary tables.
Signal name SO/SISPISO changed to SO/SPISO in the Signal Descrip-
tions table.
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DS1035 Revision History