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MC908QY8CDWE Datasheet, PDF (228/232 Pages) Freescale Semiconductor, Inc – Addendum to MC68HC908QB8, rev. 3
Electrical Specifications
18.17 Memory Characteristics
Characteristic
RAM data retention voltage (2)
FLASH program bus clock frequency
Symbol
VRDR
—
Min
Typ(1)
Max
Unit
1.3
—
—
V
1
—
—
MHz
FLASH PGM/ERASE supply voltage (VDD)
FLASH read bus clock frequency
FLASH page erase time
<1 K cycles
>1 K cycles
VPGM/ERASE
2.7
—
5.5
V
fRead(3)
0
—
8M
Hz
tErase
0.9
1
1.1
ms
3.6
4
5.5
FLASH mass erase time
FLASH PGM/ERASE to HVEN setup time
FLASH high-voltage hold time
FLASH high-voltage hold time (mass erase)
FLASH program hold time
FLASH program time
FLASH return to read time
FLASH cumulative program HV period
FLASH endurance(6)
FLASH data retention time(7)
tMErase
tNVS
tNVH
tNVHL
tPGS
tPROG
tRCV(4)
tHV(5)
—
—
4
10
5
100
5
30
1
—
10 k
15
—
—
—
—
—
—
—
—
100 k
100
—
ms
—
μs
—
μs
—
μs
—
μs
40
μs
—
μs
4
ms
—
Cycles
—
Years
1. Typical values are for reference only and are not tested in production.
2. Values are based on characterization results, not tested in production.
3. fRead is defined as the frequency range for which the FLASH memory can be read.
4. tRCV is defined as the time it needs before the FLASH can be read after turning off the high voltage charge pump, by clear-
ing HVEN to 0.
5. tHV is defined as the cumulative high voltage programming time to the same row before next erase.
tHV must satisfy this condition: tNVS + tNVH + tPGS + (tPROG x 32) ≤ tHV maximum.
6. Typical endurance was evaluated for this product family. For additional information on how Freescale Semiconductor
defines Typical Endurance, please refer to Engineering Bulletin EB619.
7. Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25•C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines Typical Data
Retention, please refer to Engineering Bulletin EB618.
MC68HC908QB8 Data Sheet, Rev. 3
226
Freescale Semiconductor